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APDS-9006-020
Miniature Surface-Mount Ambient Light Photo Sensor
Data Sheet
Description
The APDS-9006 is a low cost analog-output ambient light photo sensor in a Reverse Mount, 4 pin miniature chipLED lead free surface mount package, with temperature and voltage compensation features. It consists of a spectrally suited photo sensor, which provides excellent responsivity that is close to the response of the human eyes, as shown in figure 2. The APDS-9006 is ideal for applications in which the measurement of ambient light is used to control display backlighting such as in Note-book, mobile phone, PDA applications that draw heavy current from display backlighting will benefit from incorporating these photo sensor products in their designs by reducing power consumption significantly. Other applications include ESS, Automatic Residential and Commercial Lighting Management.
Features
* Excellent responsivity which peaks in the human luminosity curve, close responsivity to the human eye * ChipLED surface-mount package - Reverse Mounting Height - 1.10mm Width - 3.20mm Depth - 1.60mm * Good output linearity across wide illumination range * Low sensitivity variation across various light sources * Stable performance over temperature and voltage * Operating temperature, -40C to 85C * Vcc supply 2.4 to 5.5V * Lead-free package
Applications
* Detection of ambient light to control display backlighting Mobile devices - Mobile phones, PDAs Computing devices - Notebooks, Webpads Consumer devices - TVs, Video Cameras, Digital Still Cameras * Automatic Residential and Commercial Lighting Management * Electronic Signs and Signals
Application Support Information
The Application Engineering Group is available to assist you with the application design associated with APDS9006 ambient light photo sensor module. You can contact them through your local sales representatives for additional details.
I/O Pins Configuration Table Pin 3 4 Symbol OUT VCC VCC NC Description OUT VCC VCC No Connect
Ordering Information
Part Number APDS-9006-00 Packaging Type Package Tape and Reel Quantity 4-pins Chipled package 500
Relative Spectral Response Vs. Wavelength
1 0.9 0.8 Response (a.u.) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Normalized sensor spectral response APDS-9006 Eye Response
Typical Application Circuit
Pin 3:V CC Pin 2:V CC
APDS-9006
Pin 1:OUT
R LOAD Pin 4:NC
0 300
400
500
600
700
800
900
1000 1100
wavelength (nm)
Figure 2. Relative Spectral Response Vs. Wavelength Figure 1. Typical application circuit for APDS-9006
Notes : PIN 2 and PIN 3 Vcc need to be externally shorted.
Figure 1 Table Component RLOAD Recommended Application Circuit Component 5k ohm
Note 1 : Refer to fig. 11 Vout vs Lux graph
Recommended Operating Conditions
Parameter Operating Temperature Storage Temperature Supply Voltage Symbol TA TS VCC Min. -40 -40 .4 Max. 85 85 5.5 Units C C V Conditions
Electrical & Optical Specifications (Ta=25C)
Parameter Photo Current (I) Photo Current (II) Dark Current Light Current Ratio Rise Time Fall Time Peak sensitivity wavelength Settling Time pulsed at Vcc Propagation delay Storage delay Symbol I_PH I_PH I_DARK I_PH / I_PH Tr Tf l Tset Td Ts Min. 8 Typ. 40 44 300 . 5 5 500 0 5 5 Max. 5 Units uA uA nA ms ms nm ms ms ms Vcc pulsed = 0V to 3V; Rload = .4K ohms; Lux = 00 [] Rl = Kohm, Lux = 00 R = Kohm, Lux=00 Rl = Kohm, Lux = 00 R = Kohm, Lux=00 Conditions Vcc =3V, Lux = 00 [] Vcc =3V, Lux = 00 [] Vcc = 3V, Lux = 0
Note : 1. Fluorescence light is used as light source, however, white LED is substituted in a mass production process 2. Illuminance by CIE standard light source (Incandescent lamp
450.0E-6 400.0E-6 350.0E-6 300.0E-6 REL I-OUT 0 100 200 300 400 500 600 700 800 900 1000 1100 LUX I-Out 250.0E-6 200.0E-6 150.0E-6 100.0E-6 50.0E-6 000.0E+0
1.2 1.0 0.8 0.6 0.4 0.2 0 -40
-20
0
20
40
60
80
100
TEMPERATURE [C]
Figure 3. Average Iout Vs Lux (Vcc = 3V, T=25C, White LED source)
Figure 4. Average relative Iout Vs Temp (Vcc = 3V, T=25C, 320 Lux)
3
1.5 1.4 1.3 1.2
REL I-OUT
1.2 1 0.8 Rel I-Out 0.6 0.4 0.2 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angle in Degrees
1.1 1 0.9 0.8 0.7 0.6 0.5 0 1 2 3 VCC 4 5 6
Figure 5. Relative Output Current Vs Vcc (Ta = 25C, 100Lux)
Figure 6. Relative Iout Vs Angle (Vcc = 3V, Ta = 25C)
16.0E-3 14.0E-3 12.0E-3 Time [Secs] 10.0E-3 8.0E-3 6.0E-3 4.0E-3 2.0E-3 000.0E+0 0 2000 4000 6000 8000 Load Resistance [Ohms]
12 T-r Settling Time [mSec] 10 8 6 4 2 0 10000 12000 0 100 200 300 400 500 LUX 600 700 800 900 1000
T-f
Figure 8. Average Rise Time , Fall Time Vs Load Resistance at Vcc = 3V
Figure 9. Average Settling Time vs Lux at Vcc=3V
1.00E-06 9.00E-07 8.00E-07 Average Vout (V) 7.00E-07 I-Dark [A] 6.00E-07 5.00E-07 4.00E-07 3.00E-07 2.00E-07 1.00E-07 0.00E+00 -40
2.5 2.0 1.5 1.0 0.5 0.0 -20 0 20 40 TEMP [C] 60 80 100
12k 7.5k 5k 4.3k 3.3k 2.7k 2.2k 1.8k 1k
0
100
200
300
400
500 Lux
600
700
800
900 1000
Figure 10. Dark current Vs temperature
Figure 11. General Luminance vs Typical Output Voltage (Vcc = 3V, T = 25C, Light Source = White LED)
4
APDS-9006 Light Measurement Circuit and Waveforms
I_pulse
VOUT GND tr td ts
90% 10% tf
5
APDS-9006 Package Outline
6
APDS-9006 Tape and Reel Dimensions
Moisture Proof Packaging Chart
All APDS-9006 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3.
Baking conditions
If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package In Reels In Bulk Temp. 60C 00C Time 48 hours 4 hours
Recommended Storage Conditions
Storage Temperature Relative Humidity 0C to 30C Below 60% RH
Time from Unsealing to Soldering
After removal from the bag, the parts should be soldered within seven days if stored at the recommended storage conditions. If times longer than seven days are needed, the parts must be stored in a dry box.
Baking should only be done once.
8
Recommended Reflow Profile
255 230 217 200 180 150 120 80 25 0 P1 HEAT UP 50 100 P2 SOLDER PASTE DRY 150 200 P3 SOLDER REFLOW 250 P4 COOL DOWN 300 t-TIME (SECONDS) R1 MAX 260C R3 R4
T - TEMPERATURE (C)
R2
60 sec to 90 sec Above 217 C
R5
Process Zone Heat Up Solder Paste Dry Solder Reflow Cool Down Time maintained above C Peak Temperature
Symbol P, R P, R P3, R3 P3, R4 P4, R5
DT 5C to 50C 50C to 00C 00C to 55C 55C to 00C 00C to 5C > C 60C > 55C 5C to 60C
Maximum DT/Dtime or Duration 3C/s 00s to 80s 3C/s -6C/s -6C/s 60s to 90s 0s to 40s 8mins
Time within 5C of actual Peak Temperature Time 5C to Peak Temperature
The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and APDS-9006 pins are heated to a temperature of 150C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3C per second to allow for even heating of both the PC board and APDS-9006 pins. Process zone P2 should be of sufficient time duration (60 to 120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200C (392F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255C (491F) for optimum results. The
dwell time above the liquidus point of solder should be between 20 and 40 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 40 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200C (392F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed 6C per second maximum. This limitation is necessary to allow the PC board and APDS-9006 pins to change dimensions evenly, putting minimal stresses on the APDS-9006. It is recommended to perform reflow soldering no more than twice.
9
Appendix A: SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal
Metal Stencil For Solder Paste Printing
1.2 Recommended Metal Solder Stencil Aperture
It is recommended that a 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. Aperture opening for shield pad is 0.6mm x 0.71mm. This is to ensure adequate printed solder paste volume and no shorting.
Aperture Opening Land Pattern 0.11
Stencil Aperture
Solder Mask PCBA Aperture Opening 3.31 Unit: mm
1.7
Figure A3. Solder stencil aperture
1.3 Adjacent Land Keep-out and Solder Mask Areas
Figure A1. Stencil and PCBA Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area.
Soldering Terminal
1.1 Recommended Land Pattern
C L 1.00
The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm.
Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended.
2.7
0.71
0.945 1.89 Aperture Opening 0.71 0.50 2.00 Unit: mm Tolerance: +/- 0.2
Mounting Center
4.31
0.60
0.60
Unit: mm
0.2 MIN. Figure A2. Recommended Land Pattern Figure A4. Adjacent land keepout and solder mask areas.
0
Appendix B: Optical Window Design for APDS-9006
2.0 Optical Window Dimensions
To ensure that the performance of the APDS-9006 will not be affected by improper window design, there are some constraints on the dimensions and design of the window. There is a constraint on the minimum size of the window, which is placed in front of the photo light sensor, so that it will not affect the angular response of the APDS-9006. This minimum dimension that is recommended will ensure at least a 35 light reception cone. If a smaller window is required, a light pipe or light guide can be used. A light pipe or light guide is a cylindrical piece of transparent plastic, which makes use of total internal reflection to focus the light. The thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material. Figure B1 and B2 illustrate the two types of window that we have recommended which could either be a flat window or a flat window with light pipe.
Table 1 and Figure B3 below show the recommended dimensions of the window. These dimension values are based on a window thickness of 1.0mm with a refractive index 1.585.
Top View
D2
D1
D1
T
WD
L
Z APDS-9006 Light Receving Area
Figure B3. Recommended Window Dimensions WD: D: T: L: D: Z: Working Distance between window front panel & APDS-9006 Window Diameter Thickness Length of Light Pipe Light Pipe Diameter Distance between window rear panel and APDS-9006
Figure B1. Window Size Determination for Flat Window
Table 1. Recommended minimum dimension for optical window WD (T+L+Z) .5 .0 .5 3.0 Flat Window (L=0.0) Z 0.5 .0 .5 .0 D1 .35 3.05 3.5 4.45 Flat window with Light Pipe D1/D2 .5/.5 T/L/Z .0/.5/0.5
All dimensions are in mm
Figure B2. Window Design of Flat Window with Light Guide
The window should be placed directly on top of the light receiving area (active area) of the photo sensor to achieve better performance and if a flat window with a light pipe is used, dimension D2 should be 1.5mm to optimize the performance of APDS-9006.
The recommended minimum window dimension is based on the assumption that the center of the window and the center of the light receiving of the photo sensor are the same. It is recommended that the tolerance for assembly be considered as well. The recommended minimum window size which will take into account of the assembly tolerance is defined as: D1 (min + assembly tolerance) = D1min + 2*(assembly tolerance) (Dimensions are in mm) D2 (min + assembly tolerance) = D2min + 2*(assembly tolerance) (Dimensions are in mm)
2.1 Optical Window Material
The material of the window is recommended to be polycarbonate. The surface finish of the plastic should be smooth, without any texture. The recommended plastic material for use as a window is available from Bayer AG and Bayer Antwerp N. V. (Europe), Bayer Corp.(USA) and Bayer Polymers Co., Ltd. (Thailand), as shown in Table 2. Table 2. Recommended Plastic Materials Material number Makrolon LQ64 Makrolon LQ34 Makrolon LQ38 Visible light transmission 8% 8% 85% Refractive index .58 .58 .58
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 00 Avago Technologies Limited. All rights reserved. AV0-0053EN - January 6, 00

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